Heated Bed Upgrade Kit | BCN3D Epsilon Series

199,95

In stock

Accelerate Your Thermal Efficiency

Minimize downtime and achieve flawless first-layer adhesion with the official BCN3D Epsilon Series Heated Bed Upgrade Kit. Engineered to withstand the demanding environments of industrial production, this high-performance silicone thermal pad eliminates warping and guarantees consistent, edge-to-edge heat distribution across large-scale prints.

Key Features

  • Ultra-Fast Silicone Heating: This high-power silicone thermal pad significantly reduces heat-up times, allowing your team to jump from setup to production with minimal delay.

  • Industrial Thermal Consistency up to 120°C: Reaches and holds stable temperatures up to 120°C, providing the uniform thermal foundation required to control shrinkage and prevent warping in large-format parts.

  • Optimized FFC Ribbon Cable Integration: Includes a premium, high-flexibility flat flexible cable (FFC) to ensure reliable communication and stable power delivery during rigorous, multi-axis movements of the printing platform (E2).

  • Engineered for the IDEX Ecosystem: Perfectly calibrated to complement the mechanical dynamics of BCN3D’s Independent Dual Extrusion System, maintaining precise leveling even when alternating between duplication and mirror printing modes.